СЭМ и ФИБ: мощная комбинация для анализа отказов печатных плат.
A Winning Team: SEM + FIB, the "Golden Combination" CIQTEK brings SEM and FIB together as a powerful team, providing critical support for PCB process optimization, reliability verification, and root cause determination of failures. SEM High-Resolution Imaging: The "Microscope" for Surface Details The SEM uses a high-resolution electron beam to capture crisp images of PCB surface morphology. It reveals solder pad plating, intermetallic compounds, micro-cracks, tin whiskers, and foreign particle contamination with exceptional clarity. Coupled with energy-dispersive X-ray spectroscopy (EDS), the SEM also performs elemental analysis on microscopic regions. This combination lets engineers identify the chemical signature of defects, making it straightforward to spot issues like short circuits, open circuits, corrosion, and plating anomalies. FIB Nanoscale Cutting: The "Scalpel" for Internal Structures While the SEM excels at surface imaging, the FIB takes over when you need to see what is happening inside the board. Using a nanometer-precision ion beam, the FIB performs targeted cross-sectioning at the exact defect location. It prepares ultra-thin slices through multi-layer boards, blind vias, and buried vias, exposing internal structures that mechanical sectioning simply cannot reach. Think of the FIB as a microscopic surgical tool. It removes material with nanometer accuracy, leaving a clean cross-section ready for imaging and analysis. CIQTEK Semiconductor Showcase: See It in Action The Beauty of the Microscopic World, Revealed in Every Detail. Here are real examples of CIQTEK electron microscopes in PCB cross-section observation: Solder Joint Interface Panorama Low magnification observation of capacitor overall morphology, viewing the real microscopic structure of the capacitor solder joint interface from the inside IMC Layer Evaluation Evaluating interlayer bonding, measuring IMC thickness and uniformity, detecting voids, cracks, and interface defects Multi-Layer Board Inner Structure Clear observation of IMC layer morphology, thickness, continuity, and density at the solder pad and solder interface Process Reliability Evaluation Evaluating trace pattern, thickness, etching quality and copper-to-substrate bonding, detecting line shift, etch defects, delamination, voids, and analyzing plating layer quality for PCB process control and reliability assessment Built for Labs That Demand Reliability CIQTEK develops its electron microscopy platforms from the ground up, covering core algorithms through hardware design. This vertical integration ensures consistent performance and long-term supply stability, which matters for labs running continuous production or multi-year research programs. The company backs its instruments with responsive technical support and regular software updates, helping users keep their systems running efficiently over time. Get in Touch If you are evaluating SEM or FIB systems for your PCB inspection workflow, the CIQTEK team can...
May 25, 2026
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